AOI
SQ3000K-B
Applications
- SMT Component Placement, Solder Quality, Special Components(Fine-pitch IC, BGA, etc.)
- THT Insertion Status, Soldering Quality, Large Components
- Semiconductor Advanced Packaging, Bump, Die, Bonding Quality
Details
Details
| Inspection Speed |
20~40㎠/Sec(2D+3D) |
| Min. Component |
0402㎜(01005in.) |
| Panel Size |
510 × 510㎜ |
| Image Resolution |
7.2㎛ / 9.9㎛ |
| Body Dimension |
1,440 x 1,700 x 1,275mm |