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리사이징_SQ3000KB1.png

SQ3000K-B

적용분야

  • SMT Component Placement, Solder Quality, Special Components(Fine-pitch IC, BGA, etc.)
  • THT Insertion Status, Soldering Quality, Large Components
  • Semiconductor Advanced Packaging, Bump, Die, Bonding Quality

상세정보

상세정보
Inspection Speed 20~40㎠/Sec(2D+3D)
Min. Component 0402㎜(01005in.)
Panel Size 510 × 510㎜
Image Resolution 7.2㎛ / 9.9㎛
Body Dimension 1,440 x 1,700 x 1,275mm
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